Global Semiconductor Assembly Equipment Market Insights and Forecast to 2028

Semiconductor Assembly Equipment is used for an integrated chip to function, it needs to be connected to the package or directly to the printed circuit. This involves wire bonding, die-bonding, and dicing. Also, it is a back end process of chip formation. Semiconductor chip assembly is also a key component of the semiconductor supply chain.
Market Analysis and Insights: Global Semiconductor Assembly Equipment Market
Due to the COVID-19 pandemic, the global Semiconductor Assembly Equipment market size is estimated to be worth US$ million in 2022 and is forecast to a readjusted size of US$ million by 2028 with a CAGR of % during the review period. Fully considering the economic change by this health crisis, Die Bonders accounting for % of the Semiconductor Assembly Equipment global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR in the post-COVID-19 period. While IDMs segment is altered to an % CAGR throughout this forecast period.
The increase in application of semiconductor ICs across many segments has increased the demand for semiconductor packaging and assembly equipment. The growth in complexity of semiconductor IC designs majorly drives the market. Recently, it has been observed that there is an increase in the need for semiconductor ICs that can perform multiple functions. Consequently, vendors have developed semiconductor ICs with complex architecture to address the rise in need for multi-functional ICs. The development of complex semiconductor ICs is a critical factor that impels the market growth during the forecast period.
In terms of production side, this report researches the Semiconductor Assembly Equipment capacity, production, growth rate, market share by manufacturers and by region (region level and country level), from 2017 to 2022, and forecast to 2028.
In terms of sales side, this report focuses on the sales of Semiconductor Assembly Equipment by region (region level and country level), by company, by Type and by Application. from 2017 to 2022 and forecast to 2028.
Global Semiconductor Assembly Equipment Scope and Segment
Semiconductor Assembly Equipment market is segmented by Type and by Application. Players, stakeholders, and other participants in the global Semiconductor Assembly Equipment market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2017-2028.
Segment by Type
Die Bonders
Wire Bonders
Packaging Equipment
Others
Segment by Application
IDMs
OSAT
By Company
ASM Pacific Technology
Kulicke & Soffa Industries
Besi
Accrutech
Shinkawa
Palomar Technologies
Hesse Mechatronics
Toray Engineering
West Bond
HYBOND
DIAS Automation
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
U.A.E