Global LED Wire Bonder Market Insights, Forecast to 2028

LED die bonder is a kind of automatic equipment which can absorb LED chips from the wafer disk and mount them on the PCB (printed circuit board) to realize the automatic bonding of LED chips and the detection of defective chips.
Market Analysis and Insights: Global LED Wire Bonder Market
Due to the COVID-19 pandemic, the global LED Wire Bonder market size is estimated to be worth US$ million in 2022 and is forecast to a readjusted size of US$ million by 2028 with a CAGR of % during the review period. Fully considering the economic change by this health crisis, Traditional LED Wire Bonder accounting for % of the LED Wire Bonder global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR in the post-COVID-19 period. While LED segment is altered to an % CAGR throughout this forecast period.
China LED Wire Bonder market size is valued at US$ million in 2021, while the US and Europe LED Wire Bonder are US$ million and US$ million, severally. The proportion of the US is % in 2021, while China and Europe are % and % respectively, and it is predicted that China proportion will reach % in 2028, trailing a CAGR of % through the analysis period. Japan, South Korea, and Southeast Asia are noteworthy markets in Asia, with CAGR %, %, and % respectively for the next 6-year period. As for the Europe LED Wire Bonder landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period.
The global key manufacturers of LED Wire Bonder include ASMPT, Xinyichang Technology, Shinkawa, Palomar, Weiheng Automation Equipment and GKG Precision Machine, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
In terms of production side, this report researches the LED Wire Bonder capacity, production, growth rate, market share by manufacturers and by region (region level and country level), from 2017 to 2022, and forecast to 2028.
In terms of sales side, this report focuses on the sales of LED Wire Bonder by region (region level and country level), by company, by Type and by Application. from 2017 to 2022 and forecast to 2028.
Global LED Wire Bonder Scope and Segment
LED Wire Bonder market is segmented by Type and by Application. Players, stakeholders, and other participants in the global LED Wire Bonder market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2017-2028.
Segment by Type
Traditional LED Wire Bonder
Mini LED Wire Bonder
Micro LED Wire Bonder
Segment by Application
LED
Triode
Semiconductor Discrete Device
DIP Type Products
SOP Type Products
Others
By Company
ASMPT
Xinyichang Technology
Shinkawa
Palomar
Weiheng Automation Equipment
GKG Precision Machine
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
U.A.E