Global Die Bonding Machine Market Insights, Forecast to 2028

Die bonding is the process of attaching a die/chip to a substrate or package. Die bonding is accomplished by using one of the following processes: 1. Eutectic; 2. Solder; 3. Adhesive; 4. Glass or Silver-Glass
Market Analysis and Insights: Global Die Bonding Machine Market
Due to the COVID-19 pandemic, the global Die Bonding Machine market size is estimated to be worth US$ million in 2022 and is forecast to a readjusted size of US$ million by 2028 with a CAGR of % during the review period. Fully considering the economic change by this health crisis, Fully Automatic accounting for % of the Die Bonding Machine global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR in the post-COVID-19 period. While Integrated Device Manufacturers (IDMs) segment is altered to an % CAGR throughout this forecast period.
China Die Bonding Machine market size is valued at US$ million in 2021, while the US and Europe Die Bonding Machine are US$ million and US$ million, severally. The proportion of the US is % in 2021, while China and Europe are % and % respectively, and it is predicted that China proportion will reach % in 2028, trailing a CAGR of % through the analysis period. Japan, South Korea, and Southeast Asia are noteworthy markets in Asia, with CAGR %, %, and % respectively for the next 6-year period. As for the Europe Die Bonding Machine landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period.
The global key manufacturers of Die Bonding Machine include Besi, ASM Pacific Technology (ASMPT), Kulicke & Soffa, Palomar Technologies, Shinkawa, DIAS Automation, Toray Engineering, Panasonic and FASFORD TECHNOLOGY, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
In terms of production side, this report researches the Die Bonding Machine capacity, production, growth rate, market share by manufacturers and by region (region level and country level), from 2017 to 2022, and forecast to 2028.
In terms of sales side, this report focuses on the sales of Die Bonding Machine by region (region level and country level), by company, by Type and by Application. from 2017 to 2022 and forecast to 2028.
Global Die Bonding Machine Scope and Segment
Die Bonding Machine market is segmented by Type and by Application. Players, stakeholders, and other participants in the global Die Bonding Machine market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2017-2028.
Segment by Type
Fully Automatic
Semi-Automatic
Manual
Segment by Application
Integrated Device Manufacturers (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)
By Company
Besi
ASM Pacific Technology (ASMPT)
Kulicke & Soffa
Palomar Technologies
Shinkawa
DIAS Automation
Toray Engineering
Panasonic
FASFORD TECHNOLOGY
West-Bond
Hybond
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
U.A.E