Global Capillary Underfill Material Market Insights and Forecast to 2028

The underfill materials are the fused formulations of the organic polymers and the inorganic fillers. It is used widely in the semiconductor packaging in order to obtain a good quality of the thermomechanical property.
Market Analysis and Insights: Global Capillary Underfill Material Market
Due to the COVID-19 pandemic, the global Capillary Underfill Material market size is estimated to be worth US$ million in 2022 and is forecast to a readjusted size of US$ million by 2028 with a CAGR of % during the review period. Fully considering the economic change by this health crisis, Epoxy Based accounting for % of the Capillary Underfill Material global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR in the post-COVID-19 period. While Chip Scale Packaging segment is altered to an % CAGR throughout this forecast period.
China Capillary Underfill Material market size is valued at US$ million in 2021, while the US and Europe Capillary Underfill Material are US$ million and US$ million, severally. The proportion of the US is % in 2021, while China and Europe are % and % respectively, and it is predicted that China proportion will reach % in 2028, trailing a CAGR of % through the analysis period. Japan, South Korea, and Southeast Asia are noteworthy markets in Asia, with CAGR %, %, and % respectively for the next 6-year period. As for the Europe Capillary Underfill Material landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period.
The global key manufacturers of Capillary Underfill Material include Zymet, H.B. Fuller, Henkel, Namics Corporation, Yincae Advanced Material, Master Bond, Alpha Assembly Solutions, LORD and AIM Metals & Alloys, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
In terms of production side, this report researches the Capillary Underfill Material capacity, production, growth rate, market share by manufacturers and by region (region level and country level), from 2017 to 2022, and forecast to 2028.
In terms of sales side, this report focuses on the sales of Capillary Underfill Material by region (region level and country level), by company, by Type and by Application. from 2017 to 2022 and forecast to 2028.
Global Capillary Underfill Material Scope and Segment
Capillary Underfill Material market is segmented by Type and by Application. Players, stakeholders, and other participants in the global Capillary Underfill Material market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2017-2028.
Segment by Type
Epoxy Based
Other
Segment by Application
Chip Scale Packaging
Flip Chips
Ball Grid Array
Others
By Company
Zymet
H.B. Fuller
Henkel
Namics Corporation
Yincae Advanced Material
Master Bond
Alpha Assembly Solutions
LORD
AIM Metals & Alloys
Shin-Etsu Chemical
Panasonic
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
U.A.E