Global Automatic Wire Bonders Market Outlook 2022

Wire bonder is a machine that is used for making interconnects between any other semiconductor device or ICs (Integrated Circuits) at the time of chip packaging. The thin-wire is used to make these connections that are generally made of gold, copper, aluminum or silver.

In the wire bonder market, there are mainly three type of wire bonder, include manual wire bonders, semi-automatic wire bonders, fully-automatic wire bonders. Someone who are knowledgeable about the wire bonding process may choose the manual wire bonders. In this report, we only focus on automatic wire bonders, includes semi-automatic wire bonders and fully-automatic wire bonders.

Market Analysis and Insights: Global Automatic Wire Bonders Market
The global Automatic Wire Bonders market was valued at US$ million in 2020 and it is expected to reach US$ million by the end of 2027, growing at a CAGR of % during 2021-2027.

Global Automatic Wire Bonders Market: Drivers and Restrains
The research report has incorporated the analysis of different factors that augment the market’s growth. It constitutes trends, restraints, and drivers that transform the market in either a positive or negative manner. This section also provides the scope of different segments and applications that can potentially influence the market in the future. The detailed information is based on current trends and historic milestones. This section also provides an analysis of the volume of production about the global market and about each type from 2016 to 2027. This section mentions the volume of production by region from 2016 to 2027. Pricing analysis is included in the report according to each type from the year 2016 to 2027, manufacturer from 2016 to 2021, region from 2016 to 2021, and global price from 2016 to 2027.
A thorough evaluation of the restrains included in the report portrays the contrast to drivers and gives room for strategic planning. Factors that overshadow the market growth are pivotal as they can be understood to devise different bends for getting hold of the lucrative opportunities that are present in the ever-growing market. Additionally, insights into market expert’s opinions have been taken to understand the market better.

Global Automatic Wire Bonders Market: Segment Analysis
The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2016 to 2027. by Application segment also provides consumption during the forecast period of 2016 to 2027. Understanding the segments helps in identifying the importance of different factors that aid the market growth.

Segment by Type
Semi-Automatic Wire Bonders
Fully-Automatic Wire Bonders

Segment by Application
Integrated Device Manufacturers (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)

By Company
Kulicke & Soffa (K&S)
ASM Pacific Technology
TPT
Hesse Mechatronics
West•Bond
Hybond
Shibuya
Ultrasonic Engineering
DIAS Automation
F&K Delvotec Bondtechnik
Shinkawa
Palomar Technologies
Micro Point Pro Ltd (MPP)
Questar Products
Anza Technology
Planar Corporation
Mech-El Industries Inc.

Production by Region
North America
Europe
China
Japan

Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
U.A.E