1 Market Overview of Fan-Out Wafer Level Packaging 1.1 Fan-Out Wafer Level Packaging Market Overview 1.1.1 Fan-Out Wafer Level Packaging Product Scope 1.1.2 Market Status and Outlook 1.2 Global Fan-Out Wafer Level Packaging Market Size Overview by Region 2015 VS 2020 VS 2026 1.3 Global Fan-Out Wafer Level Packaging Market Size by Region (2015-2026) 1.4 Global Fan-Out Wafer Level Packaging Historic Market Size by Region (2015-2020) 1.5 Global Fan-Out Wafer Level Packaging Market Size Forecast by Region (2021-2026) 1.6 Key Regions, Fan-Out Wafer Level Packaging Market Size YoY Growth (2015-2026) 1.6.1 North America Fan-Out Wafer Level Packaging Market Size YoY Growth (2015-2026) 1.6.2 Europe Fan-Out Wafer Level Packaging Market Size YoY Growth (2015-2026) 1.6.3 Asia-Pacific Fan-Out Wafer Level Packaging Market Size YoY Growth (2015-2026) 1.6.4 Latin America Fan-Out Wafer Level Packaging Market Size YoY Growth (2015-2026) 1.6.5 Middle East & Africa Fan-Out Wafer Level Packaging Market Size YoY Growth (2015-2026) 2 Fan-Out Wafer Level Packaging Market Overview by Type 2.1 Global Fan-Out Wafer Level Packaging Market Size by Type: 2015 VS 2020 VS 2026 2.2 Global Fan-Out Wafer Level Packaging Historic Market Size by Type (2015-2020) 2.3 Global Fan-Out Wafer Level Packaging Forecasted Market Size by Type (2021-2026) 2.4 High Density Fan-Out Package 2.5 Core Fan-Out Package 3 Fan-Out Wafer Level Packaging Market Overview by Application 3.1 Global Fan-Out Wafer Level Packaging Market Size by Application: 2015 VS 2020 VS 2026 3.2 Global Fan-Out Wafer Level Packaging Historic Market Size by Application (2015-2020) 3.3 Global Fan-Out Wafer Level Packaging Forecasted Market Size by Application (2021-2026) 3.4 CMOS Image Sensor 3.5 A Wireless Connection 3.6 Logic and Memory Integrated Circuits 3.7 Mems and Sensors 3.8 Analog and Hybrid Integrated Circuits 3.9 Others 4 Global Fan-Out Wafer Level Packaging Competition Analysis by Players 4.1 Global Fan-Out Wafer Level Packaging Market Size (Million US$) by Players (2015-2020) 4.2 Global Top Manufacturers by Company Type (Tier 1, Tier 2 and Tier 3) (based on the Revenue in Fan-Out Wafer Level Packaging as of 2019) 4.3 Date of Key Manufacturers Enter into Fan-Out Wafer Level Packaging Market 4.4 Global Top Players Fan-Out Wafer Level Packaging Headquarters and Area Served 4.5 Key Players Fan-Out Wafer Level Packaging Product Solution and Service 4.6 Competitive Status 4.6.1 Fan-Out Wafer Level Packaging Market Concentration Rate 4.6.2 Mergers & Acquisitions, Expansion Plans 5 Company (Top Players) Profiles and Key Data 5.1 TSMC 5.1.1 TSMC Profile 5.1.2 TSMC Main Business 5.1.3 TSMC Products, Services and Solutions 5.1.4 TSMC Revenue (US$ Million) & (2015-2020) 5.1.5 TSMC Recent Developments 5.2 ASE Technology Holding Co. 5.2.1 ASE Technology Holding Co. Profile 5.2.2 ASE Technology Holding Co. Main Business and Company’s Total Revenue 5.2.3 ASE Technology Holding Co. Products, Services and Solutions 5.2.4 ASE Technology Holding Co. Revenue (US$ Million) (2015-2020) 5.2.5 ASE Technology Holding Co. Recent Development and Reaction to Covid-19 5.3 JCET Group 5.5.1 JCET Group Profile 5.3.2 JCET Group Main Business 5.3.3 JCET Group Products, Services and Solutions 5.3.4 JCET Group Revenue (US$ Million) & (2015-2020) 5.3.5 Amkor Technology Recent Developments 5.4 Amkor Technology 5.4.1 Amkor Technology Profile 5.4.2 Amkor Technology Main Business 5.4.3 Amkor Technology Products, Services and Solutions 5.4.4 Amkor Technology Revenue (US$ Million) & (2015-2020) 5.4.5 Amkor Technology Recent Developments 5.5 Siliconware Technology (SuZhou) Co. 5.5.1 Siliconware Technology (SuZhou) Co. Profile 5.5.2 Siliconware Technology (SuZhou) Co. Main Business 5.5.3 Siliconware Technology (SuZhou) Co. Products, Services and Solutions 5.5.4 Siliconware Technology (SuZhou) Co. Revenue (US$ Million) & (2015-2020) 5.5.5 Siliconware Technology (SuZhou) Co. Recent Developments 5.6 Nepes 5.6.1 Nepes Profile 5.6.2 Nepes Main Business 5.6.3 Nepes Products, Services and Solutions 5.6.4 Nepes Revenue (US$ Million) & (2015-2020) 5.6.5 Nepes Recent Developments ... 6 North America 6.1 North America Fan-Out Wafer Level Packaging Market Size by Country 6.2 United States 6.3 Canada 7 Europe 7.1 Europe Fan-Out Wafer Level Packaging Market Size by Country 7.2 Germany 7.3 France 7.4 U.K. 7.5 Italy 7.6 Russia 7.7 Nordic 7.8 Rest of Europe 8 Asia-Pacific 8.1 Asia-Pacific Fan-Out Wafer Level Packaging Market Size by Region 8.2 China 8.3 Japan 8.4 South Korea 8.5 Southeast Asia 8.6 India 8.7 Australia 8.8 Rest of Asia-Pacific 9 Latin America 9.1 Latin America Fan-Out Wafer Level Packaging Market Size by Country 9.2 Mexico 9.3 Brazil 9.4 Rest of Latin America 10 Middle East & Africa 10.1 Middle East & Africa Fan-Out Wafer Level Packaging Market Size by Country 10.2 Turkey 10.3 Saudi Arabia 10.4 UAE 10.5 Rest of Middle East & Africa 11 Fan-Out Wafer Level Packaging Market Dynamics 11.1 Industry Trends 11.2 Market Drivers 11.3 Market Challenges 11.4 Market Restraints 12 Research Finding /Conclusion 13 Methodology and Data Source 13.1 Methodology/Research Approach 13.1.1 Research Programs/Design 13.1.2 Market Size Estimation 13.1.3 Market Breakdown and Data Triangulation 13.2 Data Source 13.2.1 Secondary Sources 13.2.2 Primary Sources 13.3 Disclaimer 13.4 Author List

List of Tables Table 1. Global Market Fan-Out Wafer Level Packaging Market Size (US$ Million) Comparison by Region 2015 VS 2020 VS 2026 Table 2. Global Fan-Out Wafer Level Packaging Market Size by Region (2015-2020) (US$ Million) Table 3. Global Fan-Out Wafer Level Packaging Market Size Share by Region (2015-2020) Table 4. Global Fan-Out Wafer Level Packaging Forecasted Market Size by Region (2021-2026) (US$ Million) Table 5. Global Fan-Out Wafer Level Packaging Forecasted Market Size Share by Region (2021-2026) Table 6. Global Fan-Out Wafer Level Packaging Market Size (US$ Million) by Type: 2015 VS 2020 VS 2026 Table 7. Global Fan-Out Wafer Level Packaging Market Size by Type (2015-2020) (US$ Million) Table 8. Global Fan-Out Wafer Level Packaging Revenue Market Share by Type (2015-2020) Table 9. Global Fan-Out Wafer Level Packaging Forecasted Market Size by Type (2021-2026) (US$ Million) Table 10. Global Fan-Out Wafer Level Packaging Revenue Market Share by Type (2021-2026) Table 11. Global Fan-Out Wafer Level Packaging Market Size (US$ Million) by Application: 2015 VS 2020 VS 2026 Table 12. Global Fan-Out Wafer Level Packaging Market Size by Application (2015-2020) (US$ Million) Table 13. Global Fan-Out Wafer Level Packaging Revenue Market Share by Application (2015-2020) Table 14. Global Fan-Out Wafer Level Packaging Forecasted Market Size by Application (2021-2026) (US$ Million) Table 15. Global Fan-Out Wafer Level Packaging Revenue Market Share by Application (2021-2026) Table 16. Global Fan-Out Wafer Level Packaging Revenue (US$ Million) by Players (2015-2020) Table 17. Global Fan-Out Wafer Level Packaging Revenue Market Share by Players (2015-2020) Table 18. Global Top Manufacturers Market Share by Company Type (Tier 1, Tier 2 and Tier 3) (based on the Revenue in Fan-Out Wafer Level Packaging as of 2019) Table 19. Date of Key Manufacturers Enter into Fan-Out Wafer Level Packaging Market Table 20. Global Fan-Out Wafer Level Packaging Top Players Headquarters and Area Served Table 21. Fan-Out Wafer Level Packaging Product Solution and Service Table 22. Global Fan-Out Wafer Level Packaging Manufacturers Market Concentration Ratio (CR5 and HHI) Table 23. Mergers & Acquisitions, Expansion Plans Table 24. TSMC Basic Information List Table 25. TSMC Description and Business Overview Table 26. TSMC Fan-Out Wafer Level Packaging Products, Services and Solutions Table 27. Revenue (Million US$) in Fan-Out Wafer Level Packaging Business of TSMC (2015-2020) Table 28. TSMC Recent Developments Table 29. ASE Technology Holding Co. Basic Information List Table 30. ASE Technology Holding Co. Description and Business Overview Table 31. ASE Technology Holding Co. Fan-Out Wafer Level Packaging Products, Services and Solutions Table 32. Revenue (Million US$) in Fan-Out Wafer Level Packaging Business of ASE Technology Holding Co. (2015-2020) Table 33. ASE Technology Holding Co. Recent Developments Table 34. JCET Group Basic Information List Table 35. JCET Group Description and Business Overview Table 36. JCET Group Fan-Out Wafer Level Packaging Products, Services and Solutions Table 37. Revenue (Million US$) in Fan-Out Wafer Level Packaging Business of JCET Group (2015-2020) Table 38. JCET Group Recent Developments Table 39. Amkor Technology Basic Information List Table 40. Amkor Technology Description and Business Overview Table 41. Amkor Technology Fan-Out Wafer Level Packaging Products, Services and Solutions Table 42. Revenue (Million US$) in Fan-Out Wafer Level Packaging Business of Amkor Technology (2015-2020) Table 43. Amkor Technology Recent Developments Table 44. Siliconware Technology (SuZhou) Co. Basic Information List Table 45. Siliconware Technology (SuZhou) Co. Description and Business Overview Table 46. Siliconware Technology (SuZhou) Co. Fan-Out Wafer Level Packaging Products, Services and Solutions Table 47. Revenue (Million US$) in Fan-Out Wafer Level Packaging Business of Siliconware Technology (SuZhou) Co. (2015-2020) Table 48. Siliconware Technology (SuZhou) Co. Recent Developments Table 49. Nepes Basic Information List Table 50. Nepes Description and Business Overview Table 51. Nepes Fan-Out Wafer Level Packaging Products, Services and Solutions Table 52. Revenue (Million US$) in Fan-Out Wafer Level Packaging Business of Nepes (2015-2020) Table 53. Nepes Recent Developments Table 54. North America Fan-Out Wafer Level Packaging Market Size by Country (2015-2020) & (US$ Million) Table 55. North America Fan-Out Wafer Level Packaging Market Size Share by Country (2015-2020) Table 56. Europe Fan-Out Wafer Level Packaging Market Size by Country (2015-2020) & (US$ Million) Table 57. Europe Fan-Out Wafer Level Packaging Market Size Share by Country (2015-2020) Table 58. Asia-Pacific Fan-Out Wafer Level Packaging Market Size by Country (2015-2020) & (US$ Million) Table 59. Asia-Pacific Fan-Out Wafer Level Packaging Market Size Share by Country (2015-2020) (US$ Million) Table 60. Latin America Fan-Out Wafer Level Packaging Market Size by Country (2015-2020) & (US$ Million) Table 61. Latin America Fan-Out Wafer Level Packaging Market Size Share by Country (2015-2020) (US$ Million) Table 62. Middle East & Africa Fan-Out Wafer Level Packaging Market Size by Players (2015-2020) (US$ Million) Table 63. Middle East & Africa Fan-Out Wafer Level Packaging Market Size Share by Players (2015-2020) (US$ Million) Table 64. Fan-Out Wafer Level Packaging Market Trends Table 65. Fan-Out Wafer Level Packaging Market Drivers Table 66. Fan-Out Wafer Level Packaging Market Challenges Table 67. Fan-Out Wafer Level Packaging Market Restriants Table 68. Research Programs/Design for This Report Table 69. Key Data Information from Secondary Sources Table 70. Key Data Information from Primary Sources List of Figures Figure 1. Global Fan-Out Wafer Level Packaging Market Size Year-over-Year 2015-2026 & (US$ Million) Figure 2. Global Fan-Out Wafer Level Packaging Market Size (US$ Million), 2015 VS 2020VS 2026 Figure 3. Global Fan-Out Wafer Level Packaging Market Share by Regions: 2020 VS 2026 Figure 4. North America Fan-Out Wafer Level Packaging Market Size (US$ Million) Growth Rate (2015-2026) Figure 5. Europe Fan-Out Wafer Level Packaging Market Size (US$ Million) and Growth Rate (2015-2026) Figure 6. Asia-Pacific Fan-Out Wafer Level Packaging Market Size (US$ Million) and Growth Rate (2015-2026) Figure 7. Latin America Fan-Out Wafer Level Packaging Market Size (US$ Million) and Growth Rate (2015-2026) Figure 8. Middle East & Africa Fan-Out Wafer Level Packaging Market Size (US$ Million) and Growth Rate (2015-2026) Figure 9. Global Fan-Out Wafer Level Packaging Market Share by Type in 2020 & 2026 Figure 10. High Density Fan-Out Package Market Size (US$ Million) YoY Growth (2015-2026) Figure 11. Core Fan-Out Package Market Size (US$ Million) YoY Growth (2015-2026) Figure 12. Global Fan-Out Wafer Level Packaging Market Size Share by Application in 2020 & 2026 Figure 13. CMOS Image Sensor Market Size (US$ Million) YoY Growth (2015-2026) Figure 14. A Wireless Connection Market Size (US$ Million) YoY Growth (2015-2026) Figure 15. Logic and Memory Integrated Circuits Market Size (US$ Million) YoY Growth (2015-2026) Figure 16. Mems and Sensors Market Size (US$ Million) YoY Growth (2015-2026) Figure 17. Analog and Hybrid Integrated Circuits Market Size (US$ Million) YoY Growth (2015-2026) Figure 18. Others Market Size (US$ Million) YoY Growth (2015-2026) Figure 19. Fan-Out Wafer Level Packaging Market Share by Company Type (Tier 1, Tier 2 and Tier 3): 2015 VS 2019 Figure 20. Global Top 5 and Top 10 Players Fan-Out Wafer Level Packaging Market Share in 2019 Figure 21. United States Fan-Out Wafer Level Packaging Market Size YoY Growth (2015-2026) & (US$ Million) Figure 22. Canada Fan-Out Wafer Level Packaging Market Size YoY Growth (2015-2026) & (US$ Million) Figure 23. Germany Fan-Out Wafer Level Packaging Market Size YoY Growth (2015-2026) & (US$ Million) Figure 24. France Fan-Out Wafer Level Packaging Market Size YoY Growth (2015-2026) & (US$ Million) Figure 25. U.K. Fan-Out Wafer Level Packaging Market Size YoY Growth (2015-2026) & (US$ Million) Figure 26. Italy Fan-Out Wafer Level Packaging Market Size YoY Growth (2015-2026) & (US$ Million) Figure 27. Russia Fan-Out Wafer Level Packaging Market Size YoY Growth (2015-2026) & (US$ Million) Figure 28. Nordic Fan-Out Wafer Level Packaging Market Size YoY Growth (2015-2026) & (US$ Million) Figure 29. Rest of Europe Fan-Out Wafer Level Packaging Market Size YoY Growth (2015-2026) & (US$ Million) Figure 30. China Fan-Out Wafer Level Packaging Market Size YoY Growth (2015-2026) & (US$ Million) Figure 31. Japan Fan-Out Wafer Level Packaging Market Size YoY Growth (2015-2026) & (US$ Million) Figure 32. South Korea Fan-Out Wafer Level Packaging Market Size YoY Growth (2015-2026) & (US$ Million) Figure 33. Southeast Asia Fan-Out Wafer Level Packaging Market Size YoY Growth (2015-2026) & (US$ Million) Figure 34. India Fan-Out Wafer Level Packaging Market Size YoY Growth (2015-2026) & (US$ Million) Figure 35. Australia Fan-Out Wafer Level Packaging Market Size YoY Growth (2015-2026) & (US$ Million) Figure 36. Rest of Asia-Pacific Fan-Out Wafer Level Packaging Market Size YoY Growth (2015-2026) & (US$ Million) Figure 37. Mexico Fan-Out Wafer Level Packaging Market Size YoY Growth (2015-2026) & (US$ Million) Figure 38. Brazil Fan-Out Wafer Level Packaging Market Size YoY Growth (2015-2026) & (US$ Million) Figure 39. Rest of Latin America Fan-Out Wafer Level Packaging Market Size YoY Growth (2015-2026) & (US$ Million) Figure 40. Turkey Fan-Out Wafer Level Packaging Market Size YoY Growth (2015-2026) & (US$ Million) Figure 41. Saudi Arabia Fan-Out Wafer Level Packaging Market Size YoY Growth (2015-2026) & (US$ Million) Figure 42. UAE Fan-Out Wafer Level Packaging Market Size YoY Growth (2015-2026) & (US$ Million) Figure 43. Rest of Middle East & Africa Fan-Out Wafer Level Packaging Market Size YoY Growth (2015-2026) & (US$ Million) Figure 44. Bottom-up and Top-down Approaches for This Report Figure 45. Data Triangulation

TSMC ASE Technology Holding Co. JCET Group Amkor Technology Siliconware Technology (SuZhou) Co. Nepes