Global High Density Interconnect Board Market Insights, Forecast to 2028

High-density interconnection (HDI) printed circuit boards use the latest technology to increase the use of printed circuit boards in the same or smaller area. It is widely used in touch screen computers and 4G communications and military, such as avionics and smart military equipment.
Market Analysis and Insights: Global High Density Interconnect Board Market
Due to the COVID-19 pandemic, the global High Density Interconnect Board market size is estimated to be worth US$ 14700 million in 2022 and is forecast to a readjusted size of US$ 26120 million by 2028 with a CAGR of 10.1% during the review period. Fully considering the economic change by this health crisis, One Order accounting for % of the High Density Interconnect Board global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR in the post-COVID-19 period. While Consumer Electronics segment is altered to an % CAGR throughout this forecast period.
China High Density Interconnect Board market size is valued at US$ million in 2021, while the US and Europe High Density Interconnect Board are US$ million and US$ million, severally. The proportion of the US is % in 2021, while China and Europe are % and % respectively, and it is predicted that China proportion will reach % in 2028, trailing a CAGR of % through the analysis period. Japan, South Korea, and Southeast Asia are noteworthy markets in Asia, with CAGR %, %, and % respectively for the next 6-year period. As for the Europe High Density Interconnect Board landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period.
The global key manufacturers of High Density Interconnect Board include Epec, LLC, Dupont, FINELINE Ltd., PCB International Inc, PCB Unlimited, NCAB Group, Unimicron, Bomin Electronics and Young Poong Group, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
In terms of production side, this report researches the High Density Interconnect Board capacity, production, growth rate, market share by manufacturers and by region (region level and country level), from 2017 to 2022, and forecast to 2028.
In terms of sales side, this report focuses on the sales of High Density Interconnect Board by region (region level and country level), by company, by Type and by Application. from 2017 to 2022 and forecast to 2028.
Global High Density Interconnect Board Scope and Segment
High Density Interconnect Board market is segmented by Type and by Application. Players, stakeholders, and other participants in the global High Density Interconnect Board market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2017-2028.
Segment by Type
One Order
Second Order
Third Order
Segment by Application
Consumer Electronics
Medical Equipment
Avionics
Military
Others
By Company
Epec, LLC
Dupont
FINELINE Ltd.
PCB International Inc
PCB Unlimited
NCAB Group
Unimicron
Bomin Electronics
Young Poong Group
LG Innotek
CMK Corporation
TTM Technologies
Advanced Circuits
Aoshikang
Andwin Corcuits
ICAPE Group
Isola Group
Bittele Electronics
PCBMay
Daeduck
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
U.A.E